BEST has a multitude of X-Ray capabilities to suit your contract non-destructive x-ray testing capabilities. To detect today’s complex microelectronic joints high resolution (1 micron) high magnification (100X to 5.000X), complex sample manipulation (to tilt and rotate the PCB or the imaging system), and sophisticated image-processing software is required.
For more information visit our site:- www.solder.net Contact Us: 3603 Edison Place Rolling Meadows IL 60008 USA Phone: 8477979250 Fax 847-797-9255 |
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